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Keywords [ solder tinning paste ] match 14 products.
Sn25Pb75 25μM Leaded Pcb Low Temp Solder Paste Gray Powder Gray Powder
Material: | SnPb |
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Melting Point: | 266±2°C |
Specific Gravity: | 9.9±0.1g/cm³ |
Sn64.7Bi35Ag0.3 Soft Solder Paste Flux 183 Deg Lead Free Medium Temperature
Material: | SnBiAg |
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Melting Point: | 183±2°C |
Specific Gravity: | 7.4±0.1g/cm³ |
45um Low Temperature Soldering Paste Sn99.3Cu0.7 No Clean Lead Free
Product Name:: | Lead-free Solder Paste |
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Melting Point: | 221 ℃ |
Tin Powder Particle Size: | 20~45um |
120 Kgf/Cm2 High Temperature Red Glue Adhesive Smt 110 Deg Tinning Soldering
Curing Conditions: | See 3 Page |
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Copper Plate Corrosion: | None |
Moisture Absorption (wt%): | ≤ 1.0 |