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Keywords [ tin solder paste ] match 14 products.
45um Low Temperature Soldering Paste Sn99.3Cu0.7 No Clean Lead Free
Product Name:: | Lead-free Solder Paste |
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Melting Point: | 221 ℃ |
Tin Powder Particle Size: | 20~45um |
Gray 20um 217 Deg No Clean Lead Free Solder Paste Melting Temperature Auxiliary Materials
Product Name:: | Lead-free Solder Paste |
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Melting Point:: | 217 ℃ |
Tin Powder Particle Size:: | 20~45um |
138 Deg Sn42Bi58 Electrical Paste Flux Low Temperature Lead Free Solder Paste Alloy Solder
Material: | SnBi |
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Melting Point: | 138±2°C |
Specific Gravity: | 8.6±0.1g/cm³ |
120 Kgf/Cm2 High Temperature Red Glue Adhesive Smt 110 Deg Tinning Soldering
Curing Conditions: | See 3 Page |
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Copper Plate Corrosion: | None |
Moisture Absorption (wt%): | ≤ 1.0 |